Ecsel Member

Besi Austria GmbH

BE Semiconductor Industries, N.V is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries offering high levels of accuracy, productivity and reliability at a low cost of ownership.

Besi Austria’s area of expertise is the development of leading-edge high-precision and high-flexibility assembly and die-handling equipment for flip-chip and multi-chip substrate and wafer-level packaging applications in a wide range of end-user markets including electronics, mobile internet, cloud server, computing, automotive, industrial, LED and solar energy, with 35 years of experience. Besi offers various machine platforms targeting different processes within the semiconductor packaging industry. Machines are designed with focus on modularity, flexibility and customization potential to be able to address technical challenges for highly advanced packaging processes, whilst still maintaining excellent yield, cost of ownership and time-to-market.

As a result, Besi is known throughout the worldwide semiconductor industry as one of the principal and most innovative providers of assembly and die-handling equipment, and as an essential research partner for several research institutes and industrial companies alike. Customers are primarily leading semiconductor manufacturers, assembly subcontractors and electronics and industrial companies.


Copyright: besi Austria GmbH

Role and Key Contribution

  • 35 years of experience in equipment development and high-precision, high-speed assembly
  • Solution provider for high-yield innovative electronic packaging and novel microsystem integration processes
  • Essential research partner for research institutes and industrial companies alike, with active involvement in National and European projects to advance Austrian R&D and industries.

Besi Austria GmbH
Innstrasse 16
6241 Radfeld